FACTS Short Course: X-ray diffraction analysis of thin films and surfaces: i) GIXRD and ii) Residual stress analysis

 FACTS Short Course: X-ray diffraction analysis of thin films and surfaces: i) GIXRD and ii) Residual stress analysis

Date/Time: 5 March 2019 (Tuesday), 14:00 -16:30 

Location: TELS room at AToM@FACTS ABN 

Speaker: Pio John Buenconsejo (Dr)

This is part of a series of short courses on X-ray scattering and diffraction analysis of thin films and surfaces. The selected topics are primarily focused on the available techniques and capabilities of FACTS.

In this course i) grazing/glancing XRD (GIXRD) and ii) residual stress analysis (RSA) will be discussed. GIXRD is a technique used to probe thin films and surfaces by controlling the depth of X-ray penetration to carry out scattering and diffraction analysis. The collected data contains depth sensitive information on phase ID, structure and microstructure. RSA is a technique used to non-destructively investigate the residual stresses in thin films and surfaces. The state of stress in the material strongly influences the mechanical and functional properties. Conventional diffraction stress analysis and thin film focused stress analysis will be discussed.

Note: Attendees should have at least a basic background knowledge of X-ray diffraction analysis