| Proj No. | A2082-251 |
| Title | The study of three-dimensional waveguide coupling |
| Summary | With the rapid development of high-speed optical communication, intelligent optical computing and sensitive optical detection, photonic integrated system is becoming an important development trend, which puts forward higher requirements for single-component performance, system integration and expandability. Multi-material system three-dimensional integration technology breaks through the device performance limitations of traditional single-material system, as well as the area and integration limitations of two-dimensional processing and integration technology, and is expected to realize a new type of optoelectronic integrated system with high speed, high efficiency, high density and low power consumption. In this project, we will investigate the coupling principle of optical waveguides in three-dimensional space. By investigating the coupling principle of 3D waveguide, we can enhance the communication bandwidth and modulated data volume of optical waveguide. We investigate the spacing and efficiency of waveguide coupling in 3D space by mode coupling principle and based on simulation. The 3D waveguide coupling arrays designed in this project will integrate more devices in the smallest size. The project will cover waveguide optics, semiconductor device physics and advanced numerical simulation tools. The learning curve should be to (1) understand the theory of mode coupling in waveguide optics, (2) simulate a basic waveguide structure and obtain its optimal coupling parameters, (3) optimize the performance of the structure in combination with algorithms such as inverse design or deep learning, and (4) as a demonstration, if the simulation results are sufficiently interesting we will attempt to fabricate the device. Through these studies, students will gain basic knowledge in optical communications and complete training in optical device design and preparation, which will help them understand the field of optical communications and prepare them to master this emerging on-chip communication and transmission technology. |
| Supervisor | Ast/P Guangwei Hu (Loc:S1 > S1 B1B > S1 B1B 39, Ext: +65 67904337) |
| Co-Supervisor | - |
| RI Co-Supervisor | - |
| Lab | Photonics I (Loc: S1-B3a-08) |
| Single/Group: | Single |
| Area: | Microelectronics and Biomedical Electronics |
| ISP/RI/SMP/SCP?: |