| Proj No. | A2269-251 |
| Title | Enhancing Composite Bonding Strength with Vertically Aligned Carbon Nanotube (VACNT) Reinforced Adhesives |
| Summary | The project will focus on improving the bonding strength of composite materials using epoxy-based adhesives reinforced with vertically aligned carbon nanotubes (VACNTs). This project explores how the exceptional mechanical properties of VACNTs can enhance adhesive performance in composite structures, particularly by introducing VACNTs that stand perpendicular to the bonding interface. Traditional epoxy adhesives used in composite bonding often suffer from limited toughness and shear strength. By incorporating VACNTs as nanoscale reinforcements, we aim to enhance load transfer across the bonded interface, improving fracture resistance and mechanical durability. Objectives of the project: Fabricating VACNT-reinforced epoxy adhesives for bonding composite sheets. Manufacturing test samples with controlled VACNT alignment and dispersion. Conducting mechanical tests (e.g., lap shear, tensile, and fracture toughness tests) to evaluate the influence of VACNT reinforcement. Analyzing the results to determine the impact of VACNTs on adhesive performance and comparing with conventional epoxy-based adhesives. Learning Outcomes: This project provides hands-on experience in nanomaterial-enhanced composites, adhesive bonding, and mechanical testing. It will equip you with practical skills in composite manufacturing, materials characterization, and experimental data analysis, preparing you for roles in advanced materials research, aerospace, and structural engineering industries. |
| Supervisor | Prof Tay Beng Kang (Loc:S1 > S1 B1A > S1 B1A 29, Ext: +65 67904533) |
| Co-Supervisor | - |
| RI Co-Supervisor | - |
| Lab | Nanoelectronics Lab. I (Loc: S1-B3a-01) |
| Single/Group: | Single |
| Area: | Microelectronics and Biomedical Electronics |
| ISP/RI/SMP/SCP?: |