| Proj No. | A2164-251 |
| Title | High-Power RF Switch Packaging: From Design to Prototyping |
| Summary | High-power RF switches play a crucial role in modern wireless and radar systems, but their performance is significantly affected by packaging. Efficient packaging must balance thermal management, impedance matching, and low parasitic effects while ensuring mechanical robustness and manufacturability. This project will involve both design and implementation of a high-power RF switch package. The selected student will: * Design RF switch packaging with considerations for signal integrity, power handling, and thermal dissipation. * Use electromagnetic simulation tools (COMSOL or ADS) to optimize RF performance. * Explore and apply thermal management techniques, such as heat sinks, thermal vias, and advanced substrate materials. * Fabricate a prototype using PCB, ceramic, or other suitable packaging methods. * Perform experimental validation using a Vector Network Analyzer (VNA) and thermal imaging techniques. This project is ideal for students interested in RF/microwave engineering, packaging technology, and hands-on prototyping. Knowledge of electromagnetic simulations, circuit design, and fabrication techniques will be advantageous. |
| Supervisor | Ast/P Mohammad Samizadeh Nikoo (Loc:S1 > S1 B1B > S1 B1B 61, Ext: ?) |
| Co-Supervisor | - |
| RI Co-Supervisor | - |
| Lab | INTEGRATED SYSTEMS RESEARCH (Loc: S1-B2A-04) |
| Single/Group: | Single |
| Area: | Wireless and Communications Engineering |
| ISP/RI/SMP/SCP?: |